2.4G
BT5.0 and above
Bestechnic
1T1R
Select
AIoT:USB, UART, I2C, SDIO,GPIO
BES2600WM AIoT Module V200Z-R
Chipset: BES2600WM
802.11a/b/g/n
BT 5.2 1T1R
On-chip RAM & Flash
28x20mm
V200Z-R is a highly integrated wireless module with voice & audio functions. It is based on BES2600 solution which features a Cortex-M33 Star dual-core MCU subsystem and a Cortex-A7 dual-core AP subsystem. Both MCU and AP subsystem are able to run RTOS and user applications.
The module supports low power Wi-Fi 4 (1x1 802.11a/b/g/n dual-band) and Bluetooth 5.2 dual-mode (support BT/BLE, LE Audio). Besides, it provides a high-performance on-board printing antenna to reduce the complexity of hardware design.
V200Z-R also provides a voice & audio CODEC subsystem and a display subsystem with 2D graphics engine. It supports MIPI DSI HD display up to HD (720P60), supports MIPI CSI Camera up to 2MPixel, and supports microphone arrays with up to three analog microphones or six digital microphones for far-field voice application. MCU subsystem runs Bluetooth upper protocol stack, and AP subsystem and 2D hardware Graphics Engine can accelerate GUI & VUI, voice & audio processing and AI tasks.
This compact module is a perfect choice for smart appliance, smart panel, entrance guard and other smart home applications.
This is a high-performance, multi-functional, cost-effective AIoT SoC and Multi-Modal V200Z-R Development Board.
CPU
CMOS single-chip fully-integrated PMU, CODEC, RF, BB, MCU and AP subsystem.
300MHz ARM Cortex-M33 Star dual-core MCU subsystem.
1GHz ARM Cortex-A7 dual-core AP subsystem with NEON.
Shared 2MB SRAM, on-chip PSRAM and on-chip NOR flashNote1.
Support TrustZone and secure boot.
Wi-Fi / BT
2.4GHz & 5GHz dual-band Wi-Fi, 1T1R, compliant to IEEE 802.11a/b/g/n.
Support 20MHz and 40MHz bandwidth.
Bluetooth 5.2 dual-mode.
Support BLE Mesh and LE audio.
A2DP v1.3/AVRCP v1.5/HFP v1.6.
Wi-Fi and Bluetooth co-existence.
Audio
Hi-Fi Stereo Audio DAC and ADC.
Far-field voice wake up.
24bit audio processing.
Support Acoustic Echo Cancellation.
Support DSD-64/128/256 decode.
Peripheral interfaces
MIPI Tx DSI and MIPI Rx CSI interface
USB2.0 HS Host or Device
4x UART interface, with flow control and configurable baud rate
50Mbps SPIx2, with serial LCD support
1.4Mbps I2C master x3
I2S/TDM
PWMx8
10-bit GPADC, 3 channels
Note1: Please refer to ordering information for detailed memory size.
Model No. | V200Z-R | Main Chipset | BES2600 |
Interface | USB2.0, UART, I2C, I2S, SDIO device, MIPI, PWM, GPIO | Wi-Fi Standard | IEEE 802.11a/b/g/n |
RF Antenna | On-board antenna / IPEX | OS Supported | RTOS, OpenHarmony |
Operating Frequency | 2.4G: 2.400~2.4835GHz 5G: 5.18GHz ~ 5.825GHz | Operating Voltage | 1.8V |
Dimension | L x W x H: 28 x 20 x2.55 mm | RF Chain | 1T1R |
Operating Temperature | -20°C to 80°C | Storage Temperature | -30°C to 125°C |
Part No. | Description |
FGV200ZRXX-00 | BES2600, Wi-Fi dual-band, a/b/g/n 1T1R, BT5.2, on-chip 16MB PSRAM and 16MB Flash, 28X20mm, with shielding, printing antenna |
FGV200ZRXX-01 | BES2600, Wi-Fi dual-band, a/b/g/n 1T1R, BT5.2, on-chip 40MB PSRAM and 32MB Flash, 28X20mm, with shielding, printing antenna |
BES2600WM AIoT Module V200Z-R
Chipset: BES2600WM
802.11a/b/g/n
BT 5.2 1T1R
On-chip RAM & Flash
28x20mm
V200Z-R is a highly integrated wireless module with voice & audio functions. It is based on BES2600 solution which features a Cortex-M33 Star dual-core MCU subsystem and a Cortex-A7 dual-core AP subsystem. Both MCU and AP subsystem are able to run RTOS and user applications.
The module supports low power Wi-Fi 4 (1x1 802.11a/b/g/n dual-band) and Bluetooth 5.2 dual-mode (support BT/BLE, LE Audio). Besides, it provides a high-performance on-board printing antenna to reduce the complexity of hardware design.
V200Z-R also provides a voice & audio CODEC subsystem and a display subsystem with 2D graphics engine. It supports MIPI DSI HD display up to HD (720P60), supports MIPI CSI Camera up to 2MPixel, and supports microphone arrays with up to three analog microphones or six digital microphones for far-field voice application. MCU subsystem runs Bluetooth upper protocol stack, and AP subsystem and 2D hardware Graphics Engine can accelerate GUI & VUI, voice & audio processing and AI tasks.
This compact module is a perfect choice for smart appliance, smart panel, entrance guard and other smart home applications.
This is a high-performance, multi-functional, cost-effective AIoT SoC and Multi-Modal V200Z-R Development Board.
CPU
CMOS single-chip fully-integrated PMU, CODEC, RF, BB, MCU and AP subsystem.
300MHz ARM Cortex-M33 Star dual-core MCU subsystem.
1GHz ARM Cortex-A7 dual-core AP subsystem with NEON.
Shared 2MB SRAM, on-chip PSRAM and on-chip NOR flashNote1.
Support TrustZone and secure boot.
Wi-Fi / BT
2.4GHz & 5GHz dual-band Wi-Fi, 1T1R, compliant to IEEE 802.11a/b/g/n.
Support 20MHz and 40MHz bandwidth.
Bluetooth 5.2 dual-mode.
Support BLE Mesh and LE audio.
A2DP v1.3/AVRCP v1.5/HFP v1.6.
Wi-Fi and Bluetooth co-existence.
Audio
Hi-Fi Stereo Audio DAC and ADC.
Far-field voice wake up.
24bit audio processing.
Support Acoustic Echo Cancellation.
Support DSD-64/128/256 decode.
Peripheral interfaces
MIPI Tx DSI and MIPI Rx CSI interface
USB2.0 HS Host or Device
4x UART interface, with flow control and configurable baud rate
50Mbps SPIx2, with serial LCD support
1.4Mbps I2C master x3
I2S/TDM
PWMx8
10-bit GPADC, 3 channels
Note1: Please refer to ordering information for detailed memory size.
Model No. | V200Z-R | Main Chipset | BES2600 |
Interface | USB2.0, UART, I2C, I2S, SDIO device, MIPI, PWM, GPIO | Wi-Fi Standard | IEEE 802.11a/b/g/n |
RF Antenna | On-board antenna / IPEX | OS Supported | RTOS, OpenHarmony |
Operating Frequency | 2.4G: 2.400~2.4835GHz 5G: 5.18GHz ~ 5.825GHz | Operating Voltage | 1.8V |
Dimension | L x W x H: 28 x 20 x2.55 mm | RF Chain | 1T1R |
Operating Temperature | -20°C to 80°C | Storage Temperature | -30°C to 125°C |
Part No. | Description |
FGV200ZRXX-00 | BES2600, Wi-Fi dual-band, a/b/g/n 1T1R, BT5.2, on-chip 16MB PSRAM and 16MB Flash, 28X20mm, with shielding, printing antenna |
FGV200ZRXX-01 | BES2600, Wi-Fi dual-band, a/b/g/n 1T1R, BT5.2, on-chip 40MB PSRAM and 32MB Flash, 28X20mm, with shielding, printing antenna |