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Product Name
Hi3921SV100 PLC-IoT Module 3121N-ISF
Hi3921SV100
0.5-5.7MHz
UART/GPIO/PWM/I2C/ADC/SPI
MCU: Cortex M3, 200MHz
22.3 x 13.0mm
Details information
Features
CPU and Storage Performance
High-performance Cortex-M3 processor, working frequency 200MHz.
Embedded SRAM 256KB.
Physical Layer Features
Realize a subset of the IEEE 1901.1 standard. For chips that also use this subset, they can achieve interconnection and interoperability.
Supports two frequency bands of 0.5-3.7MHZ and 2.5-5.7MHZ. The frequency bands can be configured by software.
Adopt OFDM technology; support BPSK, QPSK modulation mode.
Support FEC and CRC functions, powerful denoising and error correction capabilities.
MAC Features
Support TDMA and CSMA/CA, and provide conflict avoidance mechanism.
Support data segmentation and reorganization to improve transmission efficiency.
Support data retransmission mechanism.
Support 4-level QoS to meet different business service quality requirements.
Networking Features
Supports automatic and fast networking, typical 200-scale, 2-level network scenarios, complete fast networking in 10s, and support fast communication.
Support dynamic routing, multi-path addressing.
Peripheral interfaces
I2C interface, UART interface, GPIO interface, PWM output, SPI,ADC input.
Communication indicators
The peak rate of the physical layer is 0.507Mbit/s, and the rate of the application layer is 80Kbps.
The receiving sensitivity is better than 0.2mVpp.
Power consumption and others
Static power consumption ≤0.15W (networking does not send packets).
Dynamic operating power ≤0.7W.
Operating temperature range: -40°C to +85°C.
Storage temperature range: -40°C to 125°C.
Package size: LxWxH:22.3*13.0*2.40mm
Applications
Magnetic/Track Light/Sensor
Block Diagram
Parameters
Ordering Information
Product Name
Hi3921SV100 PLC-IoT Module 3121N-ISF
Hi3921SV100
0.5-5.7MHz
UART/GPIO/PWM/I2C/ADC/SPI
MCU: Cortex M3, 200MHz
22.3 x 13.0mm
Details information
Features
CPU and Storage Performance
High-performance Cortex-M3 processor, working frequency 200MHz.
Embedded SRAM 256KB.
Physical Layer Features
Realize a subset of the IEEE 1901.1 standard. For chips that also use this subset, they can achieve interconnection and interoperability.
Supports two frequency bands of 0.5-3.7MHZ and 2.5-5.7MHZ. The frequency bands can be configured by software.
Adopt OFDM technology; support BPSK, QPSK modulation mode.
Support FEC and CRC functions, powerful denoising and error correction capabilities.
MAC Features
Support TDMA and CSMA/CA, and provide conflict avoidance mechanism.
Support data segmentation and reorganization to improve transmission efficiency.
Support data retransmission mechanism.
Support 4-level QoS to meet different business service quality requirements.
Networking Features
Supports automatic and fast networking, typical 200-scale, 2-level network scenarios, complete fast networking in 10s, and support fast communication.
Support dynamic routing, multi-path addressing.
Peripheral interfaces
I2C interface, UART interface, GPIO interface, PWM output, SPI,ADC input.
Communication indicators
The peak rate of the physical layer is 0.507Mbit/s, and the rate of the application layer is 80Kbps.
The receiving sensitivity is better than 0.2mVpp.
Power consumption and others
Static power consumption ≤0.15W (networking does not send packets).
Dynamic operating power ≤0.7W.
Operating temperature range: -40°C to +85°C.
Storage temperature range: -40°C to 125°C.
Package size: LxWxH:22.3*13.0*2.40mm
Applications
Magnetic/Track Light/Sensor
Block Diagram
Parameters
Ordering Information
